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Laser PCB Depaneling Machine 17W 2.0mm PCB Thick Groove V Cut Machine

1 set
MOQ
Negotiable
Price
Laser PCB Depaneling Machine 17W 2.0mm PCB  Thick Groove V Cut Machine
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Features
Specifications
PCB Thickness:: 0.1-2.0mm
PCB Material: FPC/FR4
Data Input Formats: Gerber, X-Gerber, DXF
Cooling: Water
Weight: 1500kgs
Name: UV Laser PCB Separator
Highlight:

17W V Cut Machine

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2.0mm V Cut Machine

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2.0mm Laser PCB Depaneling Machine

Basic Infomation
Place of Origin: China
Brand Name: SMTfly pcb depaneling
Certification: CE ROHS
Model Number: SMTfly-5L
Payment & Shipping Terms
Packaging Details: each set be packed in plywood case
Delivery Time: 7 days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 260 sets per month
Product Description

 

17W UV Laser PCB Separator for Precision Cutting of Complex Contours

 

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

 

 

 

 

 Specification

 

Laser class 1
Max. working area (X x Y x Z) 300 mm x 300 mm x 11 mm
Max. recognition area (X x Y) 300 mm x 300 mm
Max. material size (X x Y) 350 mm x 350 mm
Data input formats Gerber, X-Gerber, DXF, HPGL,
Max. structuring speed Depends on application
Positioning accuracy ± 25 μm (1 Mil)
Diameter of focused laser beam 20 μm (0.8 Mil)
Laser wavelength 355 nm
System dimensions (W x H x D) 1000mm*940mm
*1520 mm
Weight ~ 450 kg (990 lbs)
Operating conditions  
Power supply 230 VAC, 50-60 Hz, 3 kVA
Cooling Air-cooled (internal water-air cooling)
Ambient temperature 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity < 60 % (non-condensing)
Required accessoires Exhaust unit

 

Why us

 

 

1. Engineers available to service machinery oversea. 

 

Engineers are available to be sent to freign countries to do machinery training and offer technical support.

2. One year warranty for the machines except accessories. 

 

Robust frame construction and Japanese steel blades obtained good appraise and recognized by and oversea clients. We offer parts for replacement under warranty free of charge, clients only need to bear freight charge.

 

3..Effective customer service. 

 

All of us together are stronger and wiser than any one of us individually. To succeed, we must assume responsibility, cooperate with fellow associates and withdepartments, effectively comminicate with one another, foster enthusiam and participate in decision-making. To be seay reachable by customers and provide prompt replies to solve their problems and create value for customers

 

4. Mature technique & forerunner to process makes high quality machinery. 

 

As largest manufactory in South China, we have 12 years experience on PCB separator machines and soldering machines. pcb router machine

Our R&D team continuously upgrade the existing machines to meet the market development trend

 

 

 

CE approval

 

Laser PCB Depaneling Machine 17W 2.0mm PCB  Thick Groove V Cut Machine 0

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Get in touch with us
Contact Person : Eric Cao
Tel : 86-13922521978
Fax : 86-769-82784046
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