PCB UV Laser Depaneling Machine 15W/17W,PCB Separator
UV Laser Depaneling Description:
Neat and smooth edge, no burr or overflow
Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.
Laser wavelength: 355nm
Rated power: 10W/12W/15W/18W@30KHz
Galvanometer working field Per One Process: 40 × 40mm
Power consumption for the hole machine: 2KW
UV Laser Depaneling Features
More quick and easy, shorten the delivery time;
High quality ,no distortion,surface clean& uniformity;
Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;
Cutting Application
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;
UV Laser Depaneling Specification
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Power | 10W/12W/15W/17W@30KHz |
| Positioning Precision of Worktable of Linear Motor | ±2μm |
| Repetition Precision of Worktable of Linear Motor | ±1μm |
| Effective Working Field | 460mmX460mm(Customizable) |
| Laser Scanning Speed | 2500mm/s (max) |
| Galvanometer Working Field Per One Process | 40mmх40mm |
UV Laser Depaneling Samples
