Auto Vision Positioning Laser PCB Depanelizer Machine with Optowave Laser Large processing format Capable to respond to the requirements of the different products
Principle of PCB laser cutting machine
Technical Parameters
| Parameter | ||
|
Technical parameters |
Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of the | 1500Kg | |
| Power | AC220 V | |
| Laser | 355 nm | |
| Laser |
Optowave 10W(US) |
|
| Material | ≤1.2 mm | |
| Precisio | ±20 μm | |
| Platfor | ±2 μm | |
| Platform | ±2 μm | |
| Working area | 600*450 mm | |
| Maximum | 3 KW | |
| Vibrating | CTI(US) | |
| Power | AC220 V | |
| Diameter | 20±5 μm | |
| Ambient | 20±2 ℃ | |
| Ambient | ＜60 % | |
| The Machine | Marble | |
Advantages
High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
Reduce energy consumption, Cost savings.
Cost-effective, fast cutting speed, stable performance
