Brief: Discover the Laser PCB Depaneling Machine with 355nm Laser Wavelength, designed for precision and efficiency in PCB singulation. This advanced machine eliminates mechanical stress, reduces tooling costs, and offers unparalleled versatility for various substrates. Perfect for high-precision cuts and complex PCB designs.
Related Product Features:
355nm laser wavelength ensures high precision and clean cuts for PCB depaneling.
No mechanical stress on substrates or circuits, preserving PCB integrity.
Versatile applications with simple settings changes for different PCB materials.
Fiducial recognition and optical recognition enhance cutting accuracy.
Capable of cutting various substrates including Rogers, FR4, ceramics, and metals.
Holds tolerances as small as <50 microns for extraordinary cut quality.
No design limitations, suitable for complex contours and multidimensional boards.
Includes a one-year warranty and overseas technical support for customer peace of mind.
Faqs:
What are the advantages of using a laser PCB depaneling machine over traditional methods?
Laser depaneling eliminates mechanical stress, reduces tooling costs, and offers higher precision and versatility compared to routing, die cutting, or dicing saws.
Can this machine handle different types of PCB materials?
Yes, the machine can depanel various substrates including Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, and copper.
What kind of technical support is available for this machine?
Engineers are available for overseas training and technical support, and the machine comes with a one-year warranty excluding accessories.