| MOQ | 1 Set |
|---|---|
| Separation Length | 450 Mm |
| Package | Plywood Case |
| Shipping Way | EXW / FOB |
| Separation Thickness | 0.3-3.5 Mm |
| Name | SMT Laser PCB Depaneling Machine |
|---|---|
| Max PCB Size | 600*460mm |
| Laser | Optowave |
| Laser Wavelength | 355nm |
| Warranty | Free For One Year |
| Name | PCB V-cut Separator Machine |
|---|---|
| Voltage | 110-220V |
| Max PCB Length | 200mm |
| PCB Thickness | 0.6-3.5mm |
| Working Air Pressure | 0.5-0.7Mpa |
| Warranty | One Year |
|---|---|
| Working Area | 450*350mm |
| Spindle | KAVO |
| Power | 220V, 4.2KW |
| Name | PCB Router Depanelizer |
| Advantage | Cutting Thick Board With Lowest Stress |
|---|---|
| Cutting Length | 200mm / 330mm/ 400mm/450mm/480mm |
| Material For The Blades | High Speed Steel |
| Package | Plywood Case |
| Warranty | Free For One Year |
| Dimensions(W*D*H) | 1220mm*1450mm*1420mm |
|---|---|
| Weight | 550kgs |
| Height Offset | 60~110mm |
| Positioning Repeatability | 0.001mm |
| Axis Working Area(max) | 680mm*360mm*50mm |
| Advantage | Cutting Thick Board With Lowest Stress |
|---|---|
| Cutting Length | 330mm |
| Material For The Blades | High Speed Steel |
| Package | Plywood Case |
| Warranty | Free For One Year |
| Advantage | Cutting Thick Board With Lowest Stress |
|---|---|
| Cutting Length | 330mm |
| Material For The Blades | High Speed Steel |
| Package | Plywood Case |
| Warranty | Free For One Year |
| Dimensions(W*D*H) | 1220mm*1450mm*1420mm |
|---|---|
| Weight | 550kgs |
| Height Offset | 60~110mm |
| Positioning Repeatability | 0.001mm |
| Axis Working Area(max) | 680mm*360mm*50mm |
| Advantage | Cutting Thick Board With Lowest Stress |
|---|---|
| Cutting Length | 200mm / 330mm/ 400mm/450mm/480mm |
| Material For The Blades | High Speed Steel |
| Package | Plywood Case |
| Warranty | Free For One Year |
