| Max PCB Size | 600*460mm |
|---|---|
| Max Component Height | 11mm |
| Laser Source | UV, CO2 |
| Cutting Precision | ±20 μm |
| Name | PCB Laser Depaneling |
| Color | White |
|---|---|
| Spindle | KAVO |
| Spindle Speed | 60000RPM |
| PCB Material | FR4, CEM, MCPCB |
| PCB Thickness | 3.0mm |
| Laser Wavelength | 355nm |
|---|---|
| Positioning Precision | ±2μm |
| Repetition Precision | ±1μm |
| Laser Scanning Speed | 2500mm/s (max) |
| Power | 220V 380v |
